Electronic devices rely on the quality of their components, with SIM card slot shields and sound card shields being no exception. To ensure these components perform optimally, it’s essential to address common quality concerns. In this guide, we will explore these issues and provide solutions to rectify them.
SIM Card Slot Shield Quality Concerns
1. Bending and Pressing Damage
One significant concern with SIM card slot shields involves damage from bending and pressing on their inner and outer surfaces. This can result from improper adjustments of the gap between the punch and the blade, leading to powder debris scattering on the mold surface.
Solution: Regularly check and fine-tune the gap between the punch and the blade to prevent pressing damage and powder debris.
2. Waste Material Accumulation
Protracted production can lead to the accumulation of small or large holes in waste materials. These holes emerge when the punching tool wears out, widening the gap and causing inefficiencies in holding waste materials.
Solution: Maintain or replace the punching tool at regular intervals to prevent issues related to waste material accumulation.
3. Contamination by Fine Iron Dust
During material feeding through the leveling and feeding machine, the presence of fine iron dust can directly result in shield damage due to dust and iron debris.
Solution: Implement proper material handling and cleaning procedures to eliminate the risk of iron dust contamination.
Shield Small Hole Cutting and Folding Challenges
1. Burrs and Uneven Cutting
Issues related to burrs and uneven cutting often arise due to a substantial gap between the punching tool and the blade. This gap can lead to burrs on one side while leaving the other side unaffected, causing dimensional defects.
Solution: Maintain precise spacing between the punching tool and the blade to ensure even cutting and prevent the formation of burrs.
2. Continuous Cutting and Folding Problems
In the final stages of shield component production, continuous cutting and folding are performed. However, issues may arise when the folding structure of the punching tool deteriorates, resulting in problems such as product odor, uneven cutting, and protrusions.
Solution: Regularly inspect and replace the folding structure to avoid these issues.
3. Challenges Related to Guiding Pins
At times, during the final step, if the guiding pin pulls and breaks the material, it can lead to unstable cutting and folding dimensions.
Solution: Ensure the proper functioning of guiding pins and maintain their integrity to prevent instability during the cutting and folding process.
Sound Card Shield Quality Problems
1. Insufficient Holes on the Front and Side
Quality issues may arise when sound card shields have fewer holes on their front and side surfaces. Several factors contribute to this, including excessive oil on the punching tool, blockages caused by small hole waste materials, misalignment of the foot pad, and obstructions in the air suction funnel.
Solution: Routinely clean and maintain equipment to prevent these issues and ensure proper hole alignment.
2. External and Internal Bending Angles
Quality problems may stem from external and internal bending angles. External bending occurs when the mold is not adequately pressed, or there is excessive waste material. Internal bending occurs when the mold is pressed too tightly, when there are excessive pressure ribs on the insert, or when there is insufficient gap between the bending punch and the insert.
Solution: Adjust the mold’s tightness appropriately and eliminate excess pressure ribs or gaps between the bending punch and the insert.
3. Side Scratches on SIM Card Slot Shields
Side scratches on SIM card slot shields can result from wear and tear on the bending punch or insert, a too-small gap between the bending punch and the insert, or the presence of waste material jamming between them.
Solution: Maintain and replace bending punches and inserts as necessary, and ensure the correct gap between them to prevent scratches.
4. Inconsistent Bending Heights
Inconsistent bending heights may occur due to improper feed length adjustments, misalignment of bending punches and inserts, or varying gap tightness during bending, leading to material pulling discrepancies.
Solution: Implement precise feed length adjustment procedures, ensure proper alignment of bending punches and inserts, and maintain consistent gap tightness during bending.
In conclusion, ensuring the quality of SIM card slot shields and sound card shields is vital in electronic manufacturing. By identifying and addressing these common quality issues, manufacturers can guarantee their products meet the highest standards, enhancing the overall performance and reliability of electronic devices.
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